https://wccftech.com/tsmc-shares-major-euv-chipmaking-lead-and-plans-for-2nm-production-plant/

A snapshot of TSMC's chipmaking process. Image: Taiwan Semiconductor Manufacturing Company

During the Taiwan Semiconductor Manufacturing Company's (TSMC) 2021 Online Technology Symposium, the company's senior vice president for operations, Mr. Y.P. Chin, shared important details for his company's chip manufacturing capacity and progress with extreme ultraviolet (EUV) lithography. TSMC houses half of the world's EUV machines and was responsible for moving more than half of global silicon wafers manufactured through the latest technology, outlined Mr. Chin. He also shared details about TSMC's manufacturing prowess with its latest technologies and the fab's progress with its 3nm, 2nm manufacturing facilities alongside a planned chip fabrication campus in Arizona.