https://wccftech.com/amd-epyc-milan-x-cpus-pack-x3d-packaging-technology-stacked-zen-3-chiplets/

AMD is allegedly stated to offer a brand new lineup of X3D MCM chips within its 3rd Gen EPYC Milan CPU stack which will be unlike anything they have done before. These new processors are seemingly going to be known as Milan-X and will be the next step in the evolution of AMD's CPUs using next-generation packaging technologies.

We did hear a rumor a while back that AMD was working on an intermittent EPYC Refresh based on its Zen 3 core architecture. The lineup was suggested to be a part of the Milan lineup with the Zen 3 CPU cores but little was known at the moment. It looks like Patrick Schur & ExecutableFix, both of who happen to be very reliable leakers and insiders, have got the first information on what AMD's next-gen EPYC parts are going to be.