https://wccftech.com/intel-next-gen-sapphire-rapids-xeon-cpu-die-shot-unveils-mcm-design-up-to-80-cores-4-chiplets/

New die shots of Intel's next-gen Sapphire Rapids Xeon CPUs have surfaced which show an MCM design that could house up to 80 cores. The leak comes from Bilibili and shows us an engineering sample of the upcoming chip.

We did get a close-up look at Intel's 4th Gen Sapphire Rapids Xeon CPU dies last month but we didn't get to see what's underneath those dies. The leaker managed to expose each of the four chiplet dies on the main interposer. With all four chiplets exposed, we can see that underneath them is a 5x4 core configuration which means each die consists of up to 80 cores. However, the entire 80 core silicon will never be released to the public due to the mesh layout.