https://wccftech.com/intel-investing-3-5-billion-in-new-mexico-10-digit-us-government-subsidies-still-havent-landed-yet/

Intel NASDAQ:INTC announced Monday that it was committing $3.5 billion to upgrade its Rio Rancho, New Mexico facility to expand its Foveros advanced packaging capacity by 40%. 

Foveros is an advanced 3D packaging technology that allows vertical stacking of compute tiles. This packaging technology is a key component of Intel’s latest chips such as the 7nm Meteor Lake processors it recently announced. In a blog post, Intel explained that Foveros allows for the integration of diverse computing engines across multiple process technologies exceeding what’s possible with single-die integration.