New Logo, New Package – Intel Core i3-10105F Spotted In Malaysia Donning Intel’s New Packaging
https://wccftech.com/new-logo-new-package-intel-core-i3-10105f-spotted-in-malaysia-donning-intels-new-packaging/
Following the leak of the Core i9-9900KS, Intel has had another product surface early. This time, what looks to be two Core i3-10105F CPUs have been spotted in Malaysia. This processor is the Core i3 Comet Lake refresh CPUs and the first thing that catches the eyes of many people isn't the fact that it's a new product, but actually the packaging. These CPUs are expected to launch alongside the 11th Gen Rocket Lake CPUs.
Everyone knows that Intel has a distinct design philosophy behind their packaging which normally is the processor in big letters with a gradient effect and then the box featuring an assortment of darker blues and a few purples as the main color. The i9 packaging features a plastic viewing port whilst the others are normal boxes. Sometimes Intel has shaken it up and had the box as a dodecahedron, but has shied away from it as it is wasteful