https://wccftech.com/sk-hynix-hbm3-memory-module-revealed-during-ocp-summit-2021-12-hi-stack-24gb-module-with-6400-mbps-transfer-speeds/

Less than a month ago, SK Hynix had confirmed the development of a new 24GB HBM3 memory with an immensely high bandwidth performance of 819GB/s per stack. This was an introduction to their next-gen high-bandwidth memory. And, since next-gen CPUs and GPUs will require faster and stronger memory, HBM3 might be the answer to the needs of newer memory technology.

Now, during the OCP Summit 2021, SK Hynix officially released the details of their next-gen memory modules. JEDEC, the group "responsible for HBM3," has still not released final specs on the new standard of memory modules. However, SK Hynix has published specifications from their initial tests, showing speeds of 5.2 Gbps to 6.4 Gbps. Unfortunately, we do not know which one of the two speeds will be close to what will be globally produced for "next-gen accelerators."