https://wccftech.com/msi-talks-intel-12th-gen-alder-lake-cpu-dies-hot-spots-best-cooling-configurations-ddr5-temperatures-power-cost-more/

MSI has shared a lot of details in their recent Insider episode of Livestreams regarding Intel's 12th Gen Alder Lake CPUs, DDR5 memory & their Z690 product lineup. The motherboard manufacturer revealed some interesting information regarding the different dies, power requirements, thermal operations, and cooling configurations for the new platform.

We know from the official announcement that Intel's 12th Gen Alder Lake Desktop CPUs will be available in two main die configurations. These include an 8+8 (C0) die which will be featured on high-end unlocked and non-K SKUs and a 6+0 (H0) die that will be used for non-K SKUs. All of the dies are based on the 10nm ESF process node (Intel 7) and feature a smaller die size compared to 14nm SKUs.