https://wccftech.com/intel-next-gen-10nm-esf-based-sapphire-rapids-xeon-cpu-die-shots-leak-out-up-to-56-active-golden-cove-cores/

New die shots of Intel's next-gen Sapphire Rapids Xeon CPUs have surfaced which show an MCM design that could house up to 60 cores. The leak comes from YuuKi-AnS who shows us a close-up of the dies that will power the 4th Gen Xeon lineup.

We did get a close-up look at Intel's 4th Gen Sapphire Rapids Xeon CPU dies last month but we didn't get to see what's underneath those dies. The leaker managed to expose each of the four chiplet dies on the main interposer. With all four chiplets exposed, we can see that underneath them is a 4x4 (1 IMC tile) core configuration which means each die consists of up to 15 cores. It should be 16 core but 1 of the core area is taken up by the IMC hence we are only left with 15 of the total cores out of which 1 will be disabled for better yields. This means that each die will in fact feature 14 cores for a total of 56 cores per CPU.