https://wccftech.com/tsmc-achieves-hvm-7nm-plus-euv/

A featured image of a wafer in TSMC's Fab14.

In a statement published yesterday, TSMC has confirmed that it has achieved High Volume Manufacturing (HVM) on its critical 7nm+ Extreme Ultra Violet (EUV) process. This is a landmark event because it marks the critical shift from a sub-EUV wavelength to EUV successfully completed by a foundry. This is something Intel and Samsung have yet to manage and will make it exponentially easier for TSMC to deliver nodes at 7nm and below.