https://wccftech.com/amd-ryzen-3000-cpu-zen-2-7nm-soldered-ihs-design/

AMD has confirmed that all of their upcoming 3rd Gen Ryzen 3000 series processors featuring the Zen 2 core architecture will feature a soldered design. Since the launch of their 1st generation, the Ryzen series has been utilizing a soldered design which helps deliver better thermal results when compared to traditional TIM application.

AMD has so far used solder on all of their Ryzen CPUs, Ryzen Theadripper CPUs and the upcoming Ryzen ‘Picasso’ APUs are also confirmed to feature Soldered IHS. Continuing the tradition, AMD will also feature solder IHS on their upcoming Ryzen 3000 series processors which are based on the Zen 2 core and supported by the X570 platform. This was confirmed by AMD’s Senior Technical Marketing Manager, Robert Hallock: