https://wccftech.com/intel-launches-lakefield-41-3d-soc-to-take-on-the-low-power-mobility-market/

Intel has finally launched its Lakefield platform that houses 5 cores on one 3D package. Consisting of 4 low power Tremont cores and high-performance core, the chip will take on the low power mobility market in just under 7W of power. This is a major innovation from Intel and a packaging technique that is yet unmatched on the market. Whether the company is able to get any design wins, however, remains to be seen. Intel has currently announced two SoCs on the Lakefield platform:

Both SKUs consist of the 4+1 design and feature a 7W TDP along with a 4MB cache. The difference is in the graphics section and the clock  speeds. For the flagship SKU, you are looking at 64 EUs that are clocked up to 500 Mhz, and is dubbed the "i5". For the i3 variant, you are looking at 48 EUs clocked at the same speed. The flagship SKU is also clocked at a higher base frequency of 1.4 GHz (compared to 800 Mhz on the i3) and can boost further as well (3.0 GHz vs 2.8 Ghz).