https://wccftech.com/qualcomm-snapdragon-875-specs-leak-integrated-x60-5g-modem-kryo-685-cpu-more/

Rumors of the Qualcomm Snapdragon 875 appeared earlier this year, stating that it would be manufactured using TSMC’s 5nm node. At the time, that was all the info we had for you, but thankfully, we’ve stumbled upon an entire list of specifications surrounding the upcoming chipset. If you want to know more about what Qualcomm could be potentially preparing later this year, read on more to find.

According to the Snapdragon 875 specifications list reported by 91mobiles, the upcoming SoC will have an integrated 5G modem, which is a welcome change if it comes true. That’s because the Snapdragon 865 isn’t paired with a Snapdragon X55 5G modem and phone manufacturers need to acquire it separately, adding more to the component costs and in turn, the Android flagship becomes more expensive. The integrated part is expected to be a Snapdragon X60 modem, which Qualcomm announced a little while back, with its official release said to take place some time in 2021.