NVIDIA May Potentially Utilize TSMC’s CoWoS Packaging for the Next-Generation GPUs

NVIDIA May Potentially Utilize TSMC’s CoWoS Packaging for the Next-Generation GPUs

4 years ago
Anonymous $9CO2RSACsf

https://wccftech.com/nvidia-may-potentially-utilize-tsmcs-cowos-packaging-for-the-next-generation-gpus/

NVIDIA could possibly be among one of the three significant clients that will make use of TSMC's CoWoS packaging, the other two clients being Xilinx and HiSilicon, according to a new report by DigiTimes. CoWoS, or Chip-on-Wafer-on-Substrate, is a 2.5D packaging technology that integrates multiple chiplets onto a single interposer. This new packaging technology features a large number of benefits, but the primary benefits include a much smaller footprint and a reduction in power consumption.

Nvidia has already used CoWoS packaging in the past, and this technology is present on a number of high-end Titan, Quadro, and Tesla graphics cards. This technology has been implemented all the way back to the Pascal era. The GP100 (Pascal) and GV100 (Volta) silicons are two specific examples that make use of CoWoS packaging. The first is based on the foundry's 16nm FinFET manufacturing process, while the latter profits from the 12nm node.