https://wccftech.com/intel-showcases-revolutionary-lakefield-chip-with-foveros-technology/

Intel Fellow Wilfred Gomes, a member of Intel’s Silicon Engineering Group, holds a processor with the advanced packaging technology called Foveros. It combines unique three-dimensional stacking with a hybrid computing architecture that mixes and matches multiple types of cores for different functions. (Credit: Walden Kirsch/Intel Corporation)

The fingernail-size Intel chip with Foveros technology is a first-of-its-kind and will be used to power the next-generation Lakefield SOC. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions.