Galaxy Z Flip 2 Could Deliver Highest Performance by Sporting a Snapdragon 875; Samsung Could Use Smaller Punch-Hole Camera
https://wccftech.com/samsung-galaxy-z-flip-2-specs-snapdragon-875-smaller-punch-hole-camera/
Samsung introduced the foldable clamshell form factor with the release of the Galaxy Z Flip and there are talks of a successor getting announced in the near future. Of course, like it is with subsequent releases, we should expect numerous improvements arriving for the Galaxy Z Flip 2, and one of them could include an upgraded chipset. Where the Galaxy Z Flip was initially offered with a Snapdragon 855 Plus, it looks as if Samsung wants to make a jump directly to the Snapdragon 875, according to a tipster.
This latest bit of info comes from Chun, who mentions that the Snapdragon 875 will fuel Samsung’s next clamshell foldable smartphone. Though there are rumors that the Snapdragon 875 will arrive in two versions, it will be refreshing to see Samsung using the latest silicon on the Galaxy Z Flip 2 than using a previous-generation version as it did with the first iteration of the Galaxy Z Flip.