Xiaomi Mi 9 Might Feature a Triple Camera Sensor at the Back Coupled With the Latest 7nm Snapdragon 8150

Xiaomi Mi 9 Might Feature a Triple Camera Sensor at the Back Coupled With the Latest 7nm Snapdragon 8150

6 years ago
Anonymous $L9wC17otzH

https://wccftech.com/xiaomi-mi-9-snapdragon-8150-triple-camera/

Now that Apple’s 2018 iPhones with the homebrewed A12 Bionic chip under the hood and the Kirin 980-powered Huawei smartphones are out, all eyes are on the next-generation chipsets of Samsung and Qualcomm. While Samsung’s in-house chipset Exynos 9820 only powers its own smartphones, the flagship Qualcomm SoCs power most of the high-end Android smartphones. Per supply insiders, the Xiaomi Mi 9 could be the first phone to be powered by the Snapdragon 8150 chipset.

However, the 7nm Qualcomm chipset will not be the only highlight of the Xiaomi Mi 9 that will be first released in China. The phone has been rumored to feature a triple rear camera system, and one of them could be a 48MP Sony IMX586 sensor. The flagship will probably come in 6GB and 8GB RAM variants, but looking at the emerging trend, there might be a 10GB RAM variant too.