https://wccftech.com/snapdragon-8150-three-cpu-clusters-gold-plus-cores/ > Qualcomm is expected to make an announcement during the month of September, showing its latest and greatest Snapdragon 8150. The chipset will be made on TSMC’s 7nm FinFET architecture, resulting in greater performance and efficiency metrics for future smartphones. Qualcomm could also be implementing a new three CPU-core cluster, delivering when performance is needed while taking advantage of the efficient cores to conserve battery life and tackling the less taxing operations. > According to Roland Quandt, a long-time technology reporter at the publication WinFuture, he states that just like the Kirin 980, the Snapdragon 8150 will be using a three CPU core cluster design. He was one of the first to leak information that Qualcomm is not going to be using the ‘Snapdragon 855’ name to address its 7nm SoC for smartphones and tablets. Instead, the chipset manufacturer is opting for a new name in order to help avoid confusion between the silicon powering mobile phones and the one powering notebooks.