https://wccftech.com/galaxy-s9-successor-snapdragon-8150-foldable-smartphone/

The Galaxy S9 Android Pie build was leaked and it definitely gave some insights about a few upcoming Samsung devices. The firmware had some references to the company’s very first foldable smartphone and Qualcomm’s next flagship chipset and all this time, we kept on believing that it was the Snapdragon 855. Turns out the SoC manufacturer’s first 7nm FinFET silicon will be called the Snapdragon 8150 and what is interesting is that this was not the only thing discovered in the build. There is a foldable device mentioned here as well.

A decompilation of the framework-res file of the leaked build has revealed files that mention the foldable smartphone’s expected codename and similar files point towards the marketing name for Qualcomm’s next high-end chipset.