https://www.businesswire.com/news/home/20180827005410/en/ > LONDON--(BUSINESS WIRE)--Aug 27, 2018-- analysts forecast the global embedded die packaging market to grow at a CAGR of almost 14% during the forecast period. > This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20180827005410/en/