https://www.theregister.co.uk/2018/07/23/oshiba_wd_96_layer_flash/

Tosh and WD's flash foundry joint venture has begun to pump out 96-layer 3D NAND chips and the two partners are using them to produce quad-level cell (QLC) products. TLC Tosh has a 1TB SSD with 3 bits/cell while it and QLC Western Dig have a 1.33 Tbit chip with 4 bits/cell.

Toshiba's XG6 is a single-sided M.2 "gumstick" (22x80mm) form factor product, updating its XG5 M.2 drive, which used 64-layer 3D NAND to produce 256GB, 512GB and 1TB drives. Both have an NVME interface.