https://www.businesswire.com/news/home/20190122006030/en/

TOKYO--(BUSINESS WIRE)--Jan 22, 2019--Toshiba Memory Corporation, the world leader in memory solutions, has started sampling [1] the industry’s first [2] Universal Flash Storage (UFS) Ver. 3.0 [3] embedded flash memory devices. The new line-up utilizes the company’s cutting-edge, 96-layer BiCS FLASH™ 3D flash memory and is available in three capacities: 128GB, 256GB and 512GB [4]. With high-speed read/write performance and low power consumption, the new devices are suitable for applications such as mobile devices, smartphones, tablets, and augmented/virtual reality systems.

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