https://phys.org/news/2018-07-heat-conducting-crystals-chips-cool.html > As consumers demand smaller, faster and more powerful electronic devices that draw more current and generate more heat, the issue of heat management is reaching a bottleneck. With current technology, there's a limit to the amount of heat that can be dissipated from the inside out. > Researchers at the University of Texas at Dallas and their collaborators at the University of Illinois at Urbana-Champaign and the University of Houston have created a potential solution, described in a study published online July 5 in the journal Science.